West Florida Components - Preforms Solder Chips Mini Bars Solderforms SN63/PB37 Kester®

Description

Solder Preform Chips
Made in USA

Stamping: Flux-Coated
Alloy: SN63/PB37
Core: Solid
Ext Flux: 290S 1.0% +/-0.3%

Preforms are put between surfaces that are being soldered. The preform area is heated locally with a soldering iron, torch, hot air tool, or the entire assembly can be passed through a suitable oven. The assembly should be heated above the liquidus temperature of the solder alloy being used. Ideal temperatures and times for reflow and intermetallic formation depend on assembly, process and alloy used. This allows manufacturing soldering operations to be completed without using extra liquid fluxing agents which reduce throughput time and increase process yield by delivering precisely the right amount of flux to solder surfaces together.

Dimensions:
Length: 4.57 mm (0.18")
Width: 2.03 mm (0.08")
Thickness: 0.076 mm (0.003")

Manufactured by: Kester®
Part Number: 70-0500-0075

Our Price: $0.18

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